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| (R) BYW29/F/FP/G-200 HIGH EFFICIENCY FAST RECOVERY DIODES MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM trr (max) VF (max) 8A 200 V 25 ns 0.85 V A A K K FEATURES AND BENEFITS Very Low Forward Losses Negligible switching losses High surge current capability Insulated packages (ISOWATT220AC, TO-220FPAC): Insulation voltage: 2000 VDC Typical insulation capacitance = 12 pF s s s s A K NC D2PAK BYW29G-200 TO-220FPAC BYW29FP-200 DESCRIPTION Single rectifier suited for Switch Mode Power Supply and high frequency DC to DC converters. Packaged in TO-220AC, ISOWATT220AC, TO-220FPAC and D2PAK, this device is intended for use in high frequency inverters, free wheeling and polarity protection applications. ABSOLUTE MAXIMUM RATINGS Symbol VRRM IF(RMS) IF(AV) Parameter Repetitive peak reverse voltage RMS forward current Average forward current = 0.5 D2PAK / TO-220AC A K A K TO-220AC BYW29-200 ISOWATT220AC BYW29F-200 Value 200 16 Tc =120C Tc = 100C tp=10ms sinusoidal 80 - 65 to + 150 + 150 8 Unit V A A ISOWATT220AC TO-220FPAC IFSM Tstg Tj Surge non repetitive forward current (All pins connected) Storage and junction temperature range Maximum operating junction temperature A C May 2002 - Ed: 4B 1/7 BYW29/F/FP/G-200 THERMAL RESISTANCE Symbol Rth (j-c) Parameter Junction to case thermal resistance TO-220AC D2PAK ISOWATT220AC TO-220FPAC Value 2.8 5 5.5 Unit C/W STATIC ELECTRICAL CHARACTERISTICS Symbol IR * Parameter Reverse leakage current Test Conditions VR = VRRM Tj = 25C Tj = 100C VF ** Forward voltage drop IF = 5 A IF = 10 A IF = 10 A Pulse test : * tp = 5 ms, duty cycle < 2 % ** tp = 380 s, duty cycle < 2 % Min. Typ. Max. 10 0.6 0.85 1.05 1.15 Unit A mA V Tj = 125C Tj = 125C Tj = 25C To evaluate the conduction losses use the following equation : P = 0.65 x IF(AV) + 0.040 IF2(RMS) RECOVERY CHARACTERISTICS Symbol trr Parameter Reverse recovery time Test Conditions Tj = 25C Irr = 0.25 A Tj = 25C dIF/dt = -50A/s tfr Forward recovery time Peak forward voltage IF = 0.5A IR = 1A IF = 1A VR = 30V 15 V 2 Min. Typ. Max. 25 35 ns Unit ns Tj = 25C IF = 1A dIF/dt = 100A/s VFR = 1.1 x VF max Tj = 25C IF = 1A dIF/dt = 100A/s VFP 2/7 BYW29/F/FP/G-200 Fig.1 : Average forward power dissipation versus average forward current. PF(av)(W) 12 = 0.05 = 0.1 = 0.2 = 0.5 Fig.2 : Peak current versus form factor. IM(A) IM 160 140 T 10 120 =1 P = 10W =tp/T tp 8 100 80 60 T 6 4 40 P = 15W 2 IF(av)(A) 0 0 1 2 3 4 5 6 7 8 =tp/T 9 10 20 tp P = 5W 11 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Fig.3 : Forward voltage drop versus forward current (maximum values). IFM(A) 100.0 Fig.4-1 : Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, D2PAK). Zth(j-c)/Rth(j-c) 1.0 = 0.5 10.0 Tj=125C = 0.2 Tj=25C = 0.1 1.0 Single pulse T VFM(V) 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 tp(s) 0.1 1.E-03 1.E-02 1.E-01 =tp/T tp 1.E+00 Fig.4-2 :Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAC, ISOWATT220AC). Zth(j-c)/Rth(j-c) 1.0 = 0.5 Fig.5-1 : Non repetitive surge peak forward current versus overload duration (TO-220AC, D2PAK). IM(A) 80 70 60 50 Tc=25C = 0.2 = 0.1 0.1 Single pulse 40 Tc=75C 30 T 20 IM Tc=120C tp(s) 0.0 1.E-03 1.E-02 1.E-01 10 t =tp/T 1.E+00 tp =0.5 t(s) 1.E-02 1.E-01 1.E+00 1.E+01 0 1.E-03 3/7 BYW29/F/FP/G-200 Fig.5-2 : Non repetitive surge peak forward current versus overload duration (TO-220FPAC, ISOWATT220AC). IM(A) 60 Fig.6 : Average current versus ambient temperature. ( = 0.5) IF(av)(A) 10 9 Rth(j-a)=Rth(j-c) ISOWATT220AC TO-220AC/DPAK 50 8 40 Tc=25C 7 6 TO-220FPAC 30 Tc=75C 5 4 3 IM t Rth(j-a)=15C:W 20 Tc=100C 2 1 0 10 =0.5 t(s) 1.E-02 1.E-01 1.E+00 Tamb(C) 0 25 50 75 100 125 150 0 1.E-03 Fig.7 : Junction capacitance versus reverse voltage applied (Typical values). C(pF) 100 F=1MHz Vosc=30mV Tj=25C Fig.8 : Reverse recovery charges versus dIF/dt (90%confidence). Qrr(nC) 1000 IF=8A VR=100V Tj=100C 100 VR(V) 10 1 10 100 1000 dIF/dt(A/s) 10 10 100 1000 Fig.9 : Peak reverse recovery current versus dIF/dt (90% confidence). IRM(A) 100 IF=8A VR=100V Tj=100C Fig.10 : Dynamic parameters versus junction temperature. Qrr; IRM[Tj] / Qrr; IRM[Tj=125C] 1.50 IF=8A VR=100V 1.25 1.00 IRM 10 0.75 0.50 QRR 0.25 dIF/dt(A/s) 1 10 100 1000 0.00 0 25 50 Tj(C) 75 100 125 150 4/7 BYW29/F/FP/G-200 Fig.11 : Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35m) for D2PAK. Rth(j-a)(C/W) 80 70 60 50 40 30 20 10 0 0 2 4 6 8 10 12 14 16 18 20 S(cm) PACKAGE MECHANICAL DATA D2PAK (Plastic) DIMENSIONS REF. A E L2 Millimeters Min. Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 8 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 0 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 0 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 8 A C2 A1 A2 D B B2 C L L3 A1 B2 B G A2 C R C2 D E G L L2 M L3 * V2 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0.016 typ. FOOT PRINT (in millimeters) 16.90 10.30 1.30 5.08 3.70 8.90 5/7 BYW29/F/FP/G-200 PACKAGE MECHANICAL DATA TO-220AC DIMENSIONS REF. A C D L7 Millimeters Min. Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 14.00 2.95 15.75 6.60 3.93 3.85 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 13.00 2.65 15.25 6.20 3.50 3.75 Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 0.511 0.104 0.600 0.244 0.137 0.147 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 0.551 0.116 0.620 0.259 0.154 0.151 H2 C L5 OI L6 L2 D A E F F1 G L9 F1 L4 H2 L2 L4 16.40 typ. 0.645 typ. F G M E L5 L6 L7 L9 M Diam. I 2.6 typ. 0.102 typ. PACKAGE MECHANICAL DATA TO-220FPAC REF. A H B DIMENSIONS Millimeters Inches Min. Max. 0.173 0.181 0.098 0.106 0.098 0.108 0.018 0.027 0.030 0.039 0.045 0.067 0.195 0.205 0.094 0.106 0.393 0.409 0.63 Typ. 1.126 1.205 0.386 0.417 0.114 0.142 0.626 0.646 0.354 0.366 0.118 0.126 Min. Max. 4.4 4.6 2.5 2.7 2.5 2.75 0.45 0.70 0.75 1 1.15 1.70 4.95 5.20 2.4 2.7 10 10.4 16 Typ. 28.6 30.6 9.8 10.6 2.9 3.6 15.9 16.4 9.00 9.30 3.00 3.20 Dia L6 L2 L3 L5 D F1 L4 L7 F G1 G E A B D E F F1 G G1 H L2 L3 L4 L5 L6 L7 Dia. 6/7 BYW29/F/FP/G-200 PACKAGE MECHANICAL DATA ISOWATT220AC A H B DIMENSIONS REF. A Millimeters Min. 4.40 2.50 2.40 0.40 0.75 1.15 4.95 10.00 28.60 15.90 9.00 3.00 Max. 4.60 2.70 2.75 0.70 1.00 1.70 5.20 10.40 30.60 16.40 9.30 3.20 Inches Min. 0.173 0.098 0.094 0.016 0.030 0.045 0.195 0.394 1.125 0.626 0.354 0.118 Max. 0.181 0.106 0.108 0.028 0.039 0.067 0.205 0.409 1.205 0.646 0.366 0.126 Diam B D E L6 L2 L3 L7 F F1 G H L2 L3 L6 L7 Diam F1 16.00 Typ. 0.630 Typ. F G D E Type BYW29-200 BYW29F-200 Marking BYW29-200 BYW29F-200 Package TO-220AC ISOWATT220AC TO-220FPAC D PAK 2 Weight 1.86 g 2.2 g 2g 1.48 g Base Qty 50 50 50 50 Delivery Mode Tube Tube Tube Tube BYW29FP-200 BYW29FP-200 BYW29G-200 s BYW29G-200 s s s s s Cooling method: by conduction (C) Recommended torque value (ISOWATT220AC, TO-220FPAC): 0.55 N.m Maximum torque value: 0.7 N.m Recommended torque value (TO-220AC): 0.8 N.m Maximum torque value: 1.0 N.m Epoxy meets UL94, V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2002 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 7/7 |
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